CleanPrint™ Technology
The Next Frontier
in Liquid Cooling is
True 3D Architecture
Monolithic pure copper cold plates with unconstrained internal 3D flow architecture. No joints. No brazing. No compromise. Geometry driven by physics, not manufacturing constraints.
99.9%
Pure Copper
650 kW/m²
Cooling Capacity
97% IACS
Conductivity
BACKED BY INDUSTRY LEADERS
SEIKO EPSON
IHI
MURATEC
FUSIONX
DEVELOPMENT BANK OF JAPAN
MIZUHU BANK
ALPHA EDISON
RAZOR’S EDGE
CLEANPRINT™ ADVANTAGE
From 2D Surface Optimization
to True 3D Cooling Architectures
Surface area has driven cold plate performance for decades. The next leap comes from controlling the full fluid volume in three dimensions.
🌊
3D Flow Distribution
Branching internal manifolds deliver coolant proportionally to local heat load — like arteries to capillaries.
🌀
Boundary Layer Disruption
Vortex generators, swirl structures, and turbulators that operate across all three axes — not just 2D features.
🔄
Integrated Flow Mixing
Internal structures redirect cool fluid from channel cores to hot walls across multiple axes simultaneously.
🔒
Monolithic Construction
Zero joints, zero leak paths, zero brazed seams. The entire flow network is one piece of pure copper.
Traditional cold plates are highways — straight, flat, simple intersections. CleanPrint™ builds the full circulatory system.
MATERIAL
99.9% Pure Copper
Fully dense, high-purity copper with 99.7% theoretical density, 97% IACS electrical conductivity, and ~390 W/mK thermal conductivity — matching wrought copper in every property that matters for heat transfer.
99.7%
Relative Density (HIPed)
ASTM B962
97%
IACS Conductivity (HIPed)
ASTM E1004
194 MPa
Ultimate Tensile Strength
ASTM E8/E8M
50%
Elongation (HIPed)
ASTM E8/E8M
8.93
Density g/cm³ (HIPed)
ASTM B962
2.5 µm
Surface Roughness (Ra)
ISO 21920
Composition (wt%)
Copper (Cu)
99.9
Carbon (C)
0.015
Iron (Fe)
0.010
Phosphorus (P)
<0.01
Oxygen (O)
<0.005
Mechanical Properties
Property
As-Sintered
HIPed
UTS (MPa)
183 ± 2
194 ± 2
Yield (MPa)
43 ± 3
43 ± 3
Elongation (%)
43 ± 1
50 ± 1
Conductivity (% IACS)
86 ± 2
97 ± 1
Density (g/cm³)
8.35
8.93
END MARKETS
Cooling Solutions for
$46B+ in Growing Markets
Data Center Liquid Cooling
$5B
→
$19B
by 2030
Rack density power: 12kW → 100kW → 300kW
Direct-to-Chip Cold Plates
$3B
→
$6B
by 2030
AI chip TDP: 1,200W → 2,200W → 3,600W
Micro-Inverters
$4B
→
$9B
by 2030
Operating range: -40°C to +65°C, 25yr life
Laser Cooling Systems
$6B
→
$12B
by 2030
Industrial >6kW, cooling is >50% of system weight
PROVEN PERFORMANCE
Cold Plate Performance, Measured and Verified
650 kW/m²
Power density at 1.58 psi ΔP, 3 lpm
In geometry only CleanPrint can build
19.6×
Improvement in thermal uniformity
Heater standard deviation: 6.89 → 0.351
0.01mm
Flatness across 300mm diameter
Production-ready surface quality
Proven
Manufacturing
Platform
1.5+ million parts built with 3DEO’s patented Intelligent Layering® technology. Production-proven across pure copper, Inconel, and stainless steel. ISO 9001:2015 certified.
1.5M+
Parts Producedr
4
Metal Systems
ISO
9001:2015
Ready to Cool What’s Next?
Whether you’re designing next-gen GPU cooling, high-power laser systems, or micro-inverter thermal solutions — let’s talk about what CleanPrint™ can do for your thermal application.
