Redefining Heat Sink Performance with
AM-Enabled Microchannel Design
As electronic devices continue to shrink while increasing in power density, traditional heat sink technologies have reached their limits. Conventional manufacturing methods and even standard AM processes fall short in resolution, geometric complexity, and material compatibility—particularly with copper. This paper outlines how 3DEO is able to overcome these challenges, enabling scalable, production-grade copper microchannel heat sinks with unmatched performance.