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Redefining Heat Sink Performance with

AM-Enabled Microchannel Design

White Paper

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Redefining Heat Sink Performance with AM-Enabled Microchannel Design

As electronic devices continue to shrink while increasing in power density, traditional heat sink technologies have reached their limits. Conventional manufacturing methods and even standard AM processes fall short in resolution, geometric complexity, and material compatibility—particularly with copper. This paper outlines how 3DEO is able to overcome these challenges, enabling scalable, production-grade copper microchannel heat sinks with unmatched performance. 

Cover of a white paper by 3DEO titled "Redefining Heat Sink Performance with AM-Enabled Microchannel Design," featuring 3DEO heat sink illustrations on a dark background.

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